Semiconductor packaging factory ASE Investment Control announced this afternoon that its Malaysian subsidiary invested RM696.96 million (about 100 million yuan) to expand its investment in Penang, Malaysia, mainly laying out advanced packaging capacity.

It is reported that ASE Investment control's ASE semiconductor has been actively expanding the capacity of Malaysia sealed test plant, in November 2022, Malaysia Penang new plant four plants and five plants broke ground, is expected to be completed in 2025, ASE pointed out at the time, will invest 300 million US dollars in 5 years, expand Malaysia production plant, purchase advanced equipment, training and training more engineering personnel.

Ase said that since 1991, the Malaysia plant has provided seal testing services to many semiconductor companies, including advanced chip seal testing in the consumer electronics, communications, industrial and automotive industries.

Ase pointed out in September last year that the annual turnover of the Penang plant is about 350 million US dollars, and it estimates that the Penang plant's turnover can double to 750 million US dollars in two to three years.

ASE Electronics (M) Sdn. Bhd, a packaging and testing plant in Penang, Malaysia, was established in February 1991 and earned NT $987 million on revenue of NT $6.972 billion in 2022, with basic net earnings per share of NT $0.48, according to the annual report and website.

ASE Malaysia Penang sealed test plant products include wire rack packaging, wire BGA packaging, crystal cladding packaging, memory packaging, wafer-scale chip size packaging (WLCSP), ASE has an Investment company in Malaysia, ASE Investment (Labuan) Inc. And ASE LabuanInc.

Semiconductor sealing and testing interface factory actively layout in Penang, Malaysia, test interface factory Yingwei has advanced to Penang, Malaysia to set up a test service base, does not rule out the establishment of a factory in Southeast Asia, may take Malaysia as a priority, is expected to set up a factory planning can be clear as soon as this year.

China Tongfu Micro advanced packaging capacity is also based on the previous acquisition of Advanced Micro Devices (AMD) under the Suzhou plant and Malaysia Penang plant.

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