Predictive analysis, customer collaboration, and simulation drive the full channel development of individual modules to ensure the highest level of electrical, mechanical, physical, and signal integrity

This connector product portfolio aims to support the development work of technology leading enterprises, ultra large scale data centers, and other enterprise customers to meet the growing market demand for generative AI, ML (machine learning), 1.6T networks, and other high-speed application systems

LISLE, Illinois - May 25, 2023- Molex, a global electronics leader and connectivity innovator, has launched the industry's first chip to chip 224G product portfolio, including next-generation cables, backplanes, board to board connectors, and Near-ASIC connector to cable solutions next to specialized integrated circuits, with transmission speeds of up to 224 Gbps PAM4. Molex has thus gained a unique advantage in meeting the industry's higher demand for the fastest available data rate, thereby meeting the growing demand for generative AI, machine learning (ML), 1.6T networks, and other high-speed application systems.

Jairo Guerrero, Vice President and General Manager of Molex Copper Solutions, stated: "Molex Molex is working closely with major technology innovators, key data centers and corporate customers to make positive preparations for the launch of 224G products. We adopt a transparent joint development method, which helps us to reach out to stakeholders in the 224G ecosystem as soon as possible to discover and solve potential performance bottlenecks and design challenges, which involves meeting the requirements from Signal integrity to reducing electromagnetic interference to more effective thermal management All aspects of the requirements within

Innovations in connectivity support the development of the 224G ecosystem

To achieve a data rate of up to 224 Gbps PAM4, a new system architecture is needed to achieve multiple chip to chip connections, which is an important and complex technical turning point. To this end, a cross functional global team composed of Molex engineers works closely with customers, technology leaders, and suppliers, utilizing the latest predictive analysis and advanced software simulation methods to accelerate the design and development of a complete set of first-class connectivity solutions, including:

Mirror Mezz Enhanced connector - an intermediate layer board to board connector without distinction between male and female ends ™ The new product in the series can connect 224 Gbps PAM4 rate circuits while meeting different connection height requirements. It overcomes PCB space limitations and manufacturing and assembly challenges, thereby reducing application costs and shortening time to market.

The Mirror Mezz Enhanced connector extends the functionality of Mirror Mezz and Mirror Mezz Pro, which has been selected as the Open Control Module (OCM) standard by the Open Accelerator Infrastructure Group in the Open Computing Project (OCP). This reinforces Molex's overall commitment to collaborate with industry leaders to support the explosive growth of AI and other accelerator infrastructure systems.

·Inception ™ Backplane connector - Molex Molex's first backplane connection system designed from the perspective of cable priority that does not distinguish between male and female plug ends provides greater application flexibility from the beginning, with variable terminal spacing (density), optimal Signal integrity, and simplified integration with multiple system architectures. The introduction of simplified SMT technology has reduced the need for complex drilling on printed circuit boards and PCB interface through-hole processing. Molex offers multiple wire gauge options, allowing you to choose the appropriate wire gauge to optimize channel performance based on customized cable lengths for both internal and external applications.

·The CX2 dual speed connector - Molex's 224 Gbps PAM4 near ASIC connector provides powerful and reliable connection performance to the cable system. It has the advantages of screw locking function after matching, integrated stress relief function, reliable mechanical friction stroke, and comprehensive protective "thumb touch" interface, ensuring long-term reliable connection. High performance dual coaxial cables and innovative shielding structures can effectively isolate Tx/Rx circuits.

·OSFP 1600 solutions - These I/O products include SMT connectors and shrouds, BiPass, and Direct Attached Cable (DAC) and Active Cable (AEC) solutions, which can achieve a total speed of 224 Gbps PAM4 per channel or 1.6T per connector. Improved shielding minimizes crosstalk and improves Signal integrity at higher Nyquist frequencies. These latest connector and cable solutions enhance mechanical robustness and durability in design.

·QSFP 800 and QSFP-DD 1600 solutions - This series of products has also been upgraded to provide SMT connectors and shrouds, Bipass, and Direct Attached Cable (DAC) and Active Cable (AEC) solutions, which can achieve a total connection speed of 224 Gbps per channel or 1.6T per connector. Molex Molex's QSFP and QSFP-DD solutions ensure mechanical robustness, improve Signal integrity, reduce thermal loads, increase design flexibility, and reduce rack costs.

Supply situation

Mirror Mezz Enhanced connectors, Inception backplane connectors, and CX2 Dual Speed dual speed connector samples will be launched this summer, while Molex's new OSFP and QSFP product samples will be released in the autumn.